PCB Technology Summary
| Build Specification | |
| IPC Class (I, II, or III) UL Registration (UL 94V0 or others) | Class I, II, III UL796 & Ul 94VO |
| Layer Count | |
| # of layers (min/max) | 1 – 10 Layers |
| Board Sizes | |
| Maximum dimensions (in.) | 16″ x 20″ |
| Board Thickness | |
| Board thickness range (in.) Thickness tolerance (%) Core thickness range (in.) | 0.016 – 0.125″ 7 – 10% 0.006 – 0.031″ |
| Warp & Twist | |
| Maximum board warp (%) | <1.0% |
| PCB edge to conductor | |
| PCB Edge to conductor (in.) | 0.008″ |
| Laminate Materials | |
| External (FR4, FR406, RCC, etc.) Internal (FR4, FR406, RCC, etc.) | FR4, FR406 FR4, FR406 |
| Material Properties | |
| Dk (Dielectric Constant #) Tg (Glass Transition in deg. C) | 4.2 – 4.6 130 – 170 |
| Surface Finish Capabilities | |
| HASL (Y/N) ENIG (Y/N) Immersion silver (Y/N) Other finishes (Types) | YES YES YES Immersion Tin |
| Finish Thickness | |
| HASL (in.) ENIG (in.) Immersion silver (in.) Other finishes (Type: in.) | 0.003 – 0.010″ 2 – 3 micro inches 6 – 18 micro inches Tin 32 – 48 micro inches |
| Lines/Spaces | |
| External minimum (in./in.) Internal minimum (in./in.) | 0.006″ 0.006″ |
| Copper Thickness | |
| External range (oz) Internal range (oz) Internal power plane (oz) | 0.5 – 2 Oz 0.5 – 2 Oz 1 – 2 Oz |
| Hole Plating | |
| Minimum plating (in.) Non-plated hole size tolerance (in.) Plated hole size tolerance (in.) | 1 mil +/- 0.003″ +/- 0.003 |
| Plating Aspect Ratio | |
| Standard (Ratio #) Extended (Ratio #) | 1:04 1:06 |
| Soldermask | |
| Soldermask Type (LPI, Dry film, etc.) Minimum dam (in.) | LPI 5 mil |
| Soldermask Registration | |
| Standard Tolerance (in.) Extended Tolerance (in.) | +/- 0.004″ ‘+/- 0.003″ |
| Soldemask Image | |
| Image Process (Photo, Laser, etc.) | Photo |
| Silkscreen | |
| Text Height (in.) Stroke Width (in.) Colors Location accuracy (in.) | 0.035″ 0.006″ White, Black +/- 0.010″ |
| VIAs (Smallest finished dia.) | |
| Drilled (in.) Buried (in.) | 0.010″ 0.012″ |
| Via plugging | |
| Percent plugged (%) | A/R |
| VIA Pad Size | |
| External (in.) Internal (in.) | 0.020″ 0.024″ |
| Routing | |
| Tolerance (in.) | +/- 0.005″ |
| V-score | |
| TTolerance (in.) | +/- 0.004″ |
| PCB Test | |
| Net List Test (% coverage) IPC-9252, Class III (Y/N) Other Tests (Type/% coverage) Impedance test (ohms/tolerance%) | 100% YES A/R 10 |
| Test Point Spacing | |
| Spacing (in.) | 40 mil |
| Delivery Lead-time | |
| Pre-production (days) Production (days) | 5 – 10 days 10 – 15 days |
| On-time Delivery | |
| OTD (% on-time) | 99% |
