Capabilities

• Single-sided / double-sided (rigid) PCBs
• Multi-layer (rigid) PCBs
• Buried vias
• Controlled impedance
• Materials include CEM1, FR4, FR404, FR5, Teflon, Getek, Microwave/High Frequency (Rogers), Polyimide, etc.
• Electroless nickel/immersion gold, immersion silver, immersion tin, HASL, SMOBC finishes.